Related Publications
- Z. Ren, Z. Yu, J. C. Kim, and J. Lee, “TSV-integrated thermoelectric cooling by holey silicon for hot spot thermal management,” Nanotechnology 30, 035201, 2019.
- Z. Ren, and J. Lee, “Thermal conductivity anisotropy in holey silicon nanostructures and its impact on thermoelectric cooling,” Nanotechnology 29, 045404, 2018.
- J. Lee, J. Lim, P. Yang, “Ballistic Phonon Transport in Holey Silicon,” Nano Letters 15, 3273–3279, 2015