Related Publications:
- A. Alqahtani, Z. Ren, J. Lee, and N. Bagherzadeh, “System Level Analysis of 3D ICs with Thermal TSVs,” ACM Journal on Emerging Technologies in Computing Systems, Vol. 14, No. 3, Article 37 (2018).
- Z. Ren, A. Alqahtani, N. Bagherzadeh, and J. Lee, “Thermal TSV Optimization and Hierarchical Floorplanning for 3D Integrated Circuits,” IEEE Transactions on Components, Packaging and Manufacturing Technology 10, 4, 599 – 610 (2020)