1. Q. Zhao, M. W. Khan, S. Farzinazar, J. Lee, and O. Boyraz, “Plasmo-Thermomechanical Radiation Detector with On-chip Optical Readout,” Optics Express, in-press.

  2. A. Alqahtani, Z. Ren, J. Lee, and N. Bagherzadeh, “System Level Analysis of 3D ICs with Thermal TSVs,” ACM Journal on Emerging Technologies in Computing Systems, Vol. 14, No. 3, Article 37, 2018.

  3. Z. Yu, L. Ferrer-Argemi, J. Kim, J. Lim, N. V. Myung,  and J. Lee, “Phase-dependent thermal conductivity of electrodeposited antimony telluride films,” Journal of Materials Chemistry C6, 3410 – 3416, 2018. (Link)

  4. A. Krishna,  and J. Lee, “Morphology-Driven Emissivity of Microscale Tree-like Structures for Radiative Thermal Management,” Nanoscale and Microscale Thermophysical Engineering, vol. 22, no. 2, 124–136, 2018. (Link)

  5. L. Ferrer-Argemi,  E. S. Aliabadi, A. Cisquella-Serra, A. Salazar, M. Madou, and J. Lee, “Size-dependent electrical and thermal conductivities of electro-mechanically-spun glassy carbon wires,” Carbon 130, 87-93, 2018. (Link)

  6. Z. Ren, and J. Lee, “Thermal conductivity anisotropy in holey silicon nanostructures and its impact on thermoelectric cooling,” Nanotechnology 29, 045404, 2018. (Link)

  7. Z. Yu, L. Ferrer-Argemi, and J. Lee, “Investigation of thermal conduction in symmetric and asymmetric nanoporous structures,” Journal of Applied Physics 122, 244305, 2017. (Link)

  8. Y. Zhou, A. Morshedifard, J. Lee, and M.J.A. Qomi, “The contribution of propagons and diffusons in heat transport through calcium-silicate-hydrates,”  Applied Physics Letters 110, 043104, 2017. (Link)

  9. C. O’Dwyer, R. Chen, J-H He, J. Lee, and K. M. Razeeb “Scientific and Technical Challenges in Thermal Transport and Thermoelectric Materials and Devices,” Journal of Solid State Science and Technology 6(3), N3058-N3064, 2017. (Link)

  10. J. Lee, W. Lee, G. Wehmeyer, S. Dhuey, D.L. Olynick, S. Cabrini, C. Dames, J. J. Urban, P. Yang, “Investigation of Phonon Coherence and Backscattering using Silicon Nanomeshes,” Nature Communications, 14054, 2017. (Link)

  11. J. Lee, W. Lee, J. Lim, Y. Yu, Q. Kong, J. J. Urban, P. Yang, “Thermal Transport in Silicon Nanowires at High Temperature up to 700 K,” Nano Letters 16, 4133–4140, 2016. (Link)

  12. J. Lim, H. Wang, J. Tang, S. C. Andrews, J. Lee, D. Lee, T. P. Russell, P. Yang, “Simultaneous Thermoelectric Property Measurement and Incoherent Phonon Transport in Holey Silicon”, ACS Nano 10, 124–1322016. (Link)

  13. Shi, L., Dames, C., Likes, J.R., Reddy, P.S., Duda, J., Cahill, D.G., Lee, J., Marconnet, A., Goodson, K.E., Bahk, J.-H., Shakouri, A., Prasher, R.S., Felts, J., King, W.P., Han, B., Bischof, J.C., 2015, “Evaluating Broader Impacts of Nanoscale Thermal Transport Research,” Nanoscale and Microscale Thermophysical Engineering, vol. 19, no. 2, 2015. (Link)

  14. J. Lee, J. Lim, P. Yang, “Ballistic Phonon Transport in Holey Silicon,” Nano Letters 15, 3273–3279, 2015. (Link)

  15. R. G.D. Jeyasingh, S. Fong, J.Lee,  Z. Li, K.-W. Chang, D. Mantegazza, M. Asheghi, K. E. Goodson, and H.-S. P. Wong, 2012, “Ultrafast Characterization of Phase-Change Material Crystallization Properties in the Melt-Quenched Amorphous Phase,” Nano Letters, nl500940z, 2014. (Link)

  16. J. Lee, E. Bozorg-Grayeli, S. Kim, M. Asheghi, H.-S. P. Wong, and K. E. Goodson, “Phonon and Electron Transport through Ge2Sb2Te5 Films and Interfaces Bounded by Metals,” Applied Physics Letters, 102, 191911, 2013. (Link)

  17. Z. Li, R.G.D. Jeyasingh, J. Lee, M. Asheghi, H.-S. P. Wong, and K. E. Goodson, 2012, “Electrothermal Modeling and Design Strategies for Multibit Phase Change Memory,” IEEE Transactions on Electron Devices, 59, 3561-3567, Dec. 2012. (Link)

  18. J. Lee, T. Kodama, Y. Won, M. Asheghi, and K. E. Goodson, “Phase Purity and the Thermoelectric Properties of Ge2Sb2Te5 Films down to 25 nm Thickness,” Journal of Applied Physics, 112, 014902, Jul. 2012. (Link)

  19. Y. Won, J. Lee, M. Asheghi, T. W. Kenny, and K. E. Goodson, “Phase and Thickness Dependent Modulus of Ge2Sb2Te5 Films down to 25 nm Thickness,” Applied Physics Letters, vol. 100, 161905, Apr. 2012. (Link)

  20. J. Lee, M. Asheghi, and K. E. Goodson, “Impact of Thermoelectric Phenomena on Phase Change Memory Performance Metrics and its Scaling,” Nanotechnology, Vol. 23, 205201, Apr. 2012. (Link)

  21. J. Lee, S. Kim, A. Marconnet, M.A.A. in ‘t Zandt, M. Asheghi, H.-S. P. Wong, and K. E. Goodson, “Thermoelectric Characterization and Power Generation Using a Silicon-on-Insulator Substrate,” Journal of Microelectromechanical Systems, 2175704, Vol. 21, Feb. 2012. (Link)

  22. S. Yoneoka, J. Lee, M. Liger, G. Yama, T. Kodama, J. Provine, R. T. Howe, K. E. Goodson, and T. W. Kenny, “Electrical and thermal conduction in ALD nanobridges down to 7-nm thickness,” Nano Letters, ln203548w, 683-6, Jan. 2012. (Link)

  23. J. Lee, S. Kim, R. Jeyasingh, M. Asheghi, H.-S. P. Wong, and K. E. Goodson, “Micro Thermal Stage for Electrothermal Characterization of Phase Change Memory,” IEEE Electron Device Letters, vol.32, no.7, pp.952-954, Jul. 2011. (Link)

  24. Z. Li, J. Lee, J. P. Reifenberg, M. Asheghi, R. Jeyasingh, H.-S. P. Wong, and K. E. Goodson, Grain Boundaries, “Grain Boundaries, Phase Impurities, and Anisotropic Thermal Conduction in Phase-Change Memory,” IEEE Electron Device Letters, vol.32, no.7, pp.961-963, Jul. 2011. (Link)

  25. J. Lee, Z. Li, J. P. Reifenberg, M. Asheghi, and K. E. Goodson, “Thermal Conductivity Anisotropy and Grain Structure of Ge2Sb2Te5 Films,” Journal of Applied Physics, vol. 109, 084902, Apr. 2011. (Link)