Publications

  1. J. Luo, and J. Lee, “Machine Learning-Assisted Thermoelectric Cooling for On-Demand Multi-Hotspot Thermal Management,” Journal of Applied Physics 135, 244503 (2024) (Link).

  2. R. Flores, S. Houssainy, W. Wang, K. N. Cu, X. Nie, N. Woolfolk, B. Polly, R. Faramarzi, J. Maclay, J. Lee, J. Brouwer, “Addressing building related energy burden, air pollution, and carbon emissions of a low-income community in Southern California,” Advances in Applied Energy 14, 100169 (2024) (Link).

  3. J. Cao, H. Wang, L. Ferrer-Argemi, P. Cao, J. Lee, “Highly Tailorable Thermomechanical Properties of Nanograined Silicon: Importance of Grain Size and Grain Anisotropy,” Applied Physics Letters 124, 082201 (2024) (Link).

  4. J. Luo , J. Lim , J. Chen, A. Venugopal, Z. Ren , and J. Lee, “Dynamic Thermal Management in SOI Transistors Using Holey Silicon-Based Thermoelectric Cooling,” IEEE Transactions on Electron Devices, in-press, DOI: 10.1109/TED.2024.3358788 (Link).

  5. X. Nie, R. Flores, J. Brouwer, and J. Lee, “Energy and cost savings of cool coatings for multifamily buildings in U.S. climate zones,” Advances in Applied Energy 13, 100159 (2024) (Link).

  6. C. A.-H. Owens, Y. Wang, S. Farzinazar, C. Yang, H. Lee, and J. Lee, “Tunable Thermal Transport in 4D Printed Mechanical Metamaterials,” Materials & Design 231, 111992 (2023) (Link).

  7. J. Sullivan, A. Mirhashemi, and J. Lee, “Deep learning-based inverse design of microstructured materials for optical optimization and thermal radiation control,” Scientific Reports 13, 7382 (2023) (Link).

  8. S. Farzinazar, Y. Wang, C. A.-H. Owens, C. Yang, H. Lee, and J. Lee, “Thermal transport in 3D printed shape memory polymer metamaterials,” APL Materials 10, 081105 (2022) (Link).

  9. J. Sullivan, A. Mirhashemi, J. Lee, “Deep learning based analysis of microstructured materials for thermal radiation control,” Scientific Reports 12, 9785 (2022) (Link).

  10. C. Park, C. Park, X. Nie, J. Lee, Y. S. Kim, and Y. Yoo, “Fully Organic and Flexible Biodegradable Emitter for Global Energy-Free Cooling Applications,” ACS Sustainable Chem. Eng. 10, 21, 7091–7099 (2022) (Link).

  11. Z. Ren, J. Cao, J. Lim, Z. Yu, J. C. Kim, and J. Lee, “Experimental Demonstration of Holey Silicon-Based Thermoelectric Cooling,” IEEE Transactions on Electron Devices, doi: 10.1109/TED.2022.3166867 (Link).

  12. J. Sullivan, Z. Yu, J. Lee, “Nanometer-Thick Nickel Coatings on Silicon Micropyramids for Infrared Absorption,” ACS Appl. Nano Mater. 2022, DOI: 10.1021/acsanm.2c00541 (Link).

  13. S. Farzinazar, , Z. Ren, , J. Lim, , J. C. Kim, and J. Lee, “Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging,”ASME. J. Electron. Packag., 144(2): 021118 (2022) (Link).

  14. A. Krishna, X. Nie, A. D. Briscoe, J. Lee, “Air temperature drives the evolution of mid-infrared optical properties of butterfly wings,” Scientific Reports volume 11, 24143 (2021) (Link).

  15. J. Sullivan, Z. Yu, J. Lee, “Optical Analysis and Optimization of Micropyramid Texture for Thermal Radiation Control,” Nanoscale and Microscale Thermophysical Engineering, DOI: 10.1080/15567265.2021.1958960 (Link).

  16. A. R. Escobar, S. Zanganeh, J. Sullivan, L. Li, M. Dautta, J. Lee, P Tseng, “Fluidic Infiltrative Assembly of 3D Hydrogel with Heterogeneous Composition and Function,” Advanced Functional Materials, 2103288 (2021) (Link).

  17. X. Nie, Z. Yu, E. Jackson, J. Lee, “Refractive index and extinction coefficient of hollow microspheres for solar reflection,” Applied Physics Letters 118, 211907 (2021) (Link).

  18. Z. Ren, J. C. Kim, J. Lee, “Transient Cooling and Heating Effects in Holey Silicon-based Lateral Thermoelectric Devices for Hot Spot Thermal Management,” IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2021.3081375 (Link).

  19. M.W. Khan, J. Sullivan, J. Lee, O. Boyraz, “High Sensitivity Long-Wave Infrared Detector Design Based on Integrated Plasmonic Absorber and VO2 Nanobeam,” IEEE Journal of Quantum Electronics, vol. 57, no. 4, pp. 1-11, 4000211 (2021) (Link). 

  20. Z. Yu, X. Nie, A. Yuksel, J. Lee, “Reflectivity of solid and hollow microsphere composites and the effects of uniform and varying diameters,” Journal of Applied Physics 128, 053103 (2020) (Link).

  21. J. C. Kim, Z. Ren, A. Yuksel, E. Dede, P. R. Bandaru, D. Oh, J. Lee, “Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging,” ASME. J. Electron. Packag. 143(1), 010801 (2021)  (Link).
  22. X. Nie, Y. Yoo, H. Hewakuruppu, J. Sullivan, A. Krishna, and J. Lee, “Cool White Polymer Coatings based on Glass Bubbles for Buildings,” Scientific Reports 10, 6661 (2020) (Link).
  23. Z. Ren, A. Alqahtani, N. Bagherzadeh, and J. Lee, “Thermal TSV Optimization and Hierarchical Floorplanning for 3D Integrated Circuits,” IEEE Transactions on Components, Packaging and Manufacturing Technology 10, 4, 599 – 610 (2020) (Link).
  24. G. A. Sevison, S. Farzinazar, J. A. Burrow, C. Perez, H. Kwon, J. Lee, M. Asheghi, K. E. Goodson, A. Sarangan, J. R. Hendrickson, I. Agha, “Phase Change Dynamics and Two-Dimensional 4-Bit Memory in Ge2Sb2Te5 via Telecom-Band Encoding,” ACS Photonics 7, 2, 480-487 (2020)(Link).
  25. A. Krishna, X. Nie, A. D. Warren, J. E. Llorente-Bousquets, A. D. Briscoe, and J. Lee, “Infrared optical and thermal properties of microstructures in butterfly wings,” Proceedings of the National Academy of Sciences 117, 3, 1566-1572 (2020) (Link).
  26. S. Farzinazar, T. A. Schaedler, L. Valdevit, and J. Lee, “Thermal Transport in Hollow Metallic Microlattices,” APL Materials 7, 101108 (2019) (Link).
  27. A. Krishna, J. M. Kim, J. Leem, M. C. Wang, S. Nam, and J. Lee, “Ultraviolet to Mid-Infrared Emissivity Control by Mechanically Reconfigurable Graphene,” Nano Letters 19, 8, 5082-5092 (2019) (Link).
  28. L. Ferrer-Argemi, Z. Yu, and J. Lee, “Effects of metal silicide inclusion interface and shape on thermal transport in silicon nanocomposites,” Journal of Applied Physics 126, 035106 (2019) (Link).
  29. L. Ferrer-Argemi, Z. Yu, J. Kim, N. V. Myung, J. Lim, and J. Lee, “Silver content dependent thermal conductivity and thermoelectric properties of electrodeposited antimony telluride thin films,” Scientific Reports 9, 9242, 2019 (Link).
  30. R. Chen, J. Lee, W. Lee, and D. Li, “Thermoelectrics of Nanowires,” Chemical Reviews 119, 15, 9260-9302 (2019). (Link).
  31. M. Sala-Casanovas†, A. Krishna†,  Z. Yu, and J. Lee, “Bio-inspired Stretchable Selective Emitters based on Corrugated Nickel for Personal Thermal Management,” Nanoscale and Microscale Thermophysical Engineering, vol. 23, no. 3, 173–187, 2019. (Link).
  32. Z. Yu, Z. Ren, and J. Lee, “Phononic topological insulators based on six-petal holey silicon structures,” Scientific Reports 9, 1805, 2019. (Link).
  33. Z. Ren, Z. Yu, J. C. Kim, and J. Lee, “TSV-integrated thermoelectric cooling by holey silicon for hot spot thermal management,” Nanotechnology 30, 035201, 2019. (Link).
  34. Q. Zhao, M. W. Khan, S. Farzinazar, J. Lee, and O. Boyraz, “Plasmo-Thermomechanical Radiation Detector with On-chip Optical Readout,” Optics Express, Vol. 26, Issue 23, pp. 29638-29650, 2018. (Link)
  35. A. Alqahtani, Z. Ren, J. Lee, and N. Bagherzadeh, “System Level Analysis of 3D ICs with Thermal TSVs,” ACM Journal on Emerging Technologies in Computing Systems, Vol. 14, No. 3, Article 37, 2018. (Link)
  36. Z. Yu, L. Ferrer-Argemi, J. Kim, J. Lim, N. V. Myung,  and J. Lee, “Phase-dependent thermal conductivity of electrodeposited antimony telluride films,” Journal of Materials Chemistry C, 6, 3410 – 3416, 2018. (Link)
  37. A. Krishna,  and J. Lee, “Morphology-Driven Emissivity of Microscale Tree-like Structures for Radiative Thermal Management,” Nanoscale and Microscale Thermophysical Engineering, vol. 22, no. 2, 124–136, 2018. (Link)
  38. L. Ferrer-Argemi,  E. S. Aliabadi, A. Cisquella-Serra, A. Salazar, M. Madou, and J. Lee, “Size-dependent electrical and thermal conductivities of electro-mechanically-spun glassy carbon wires,” Carbon 130, 87-93, 2018. (Link)
  39. Z. Ren, and J. Lee, “Thermal conductivity anisotropy in holey silicon nanostructures and its impact on thermoelectric cooling,” Nanotechnology 29, 045404, 2018. (Link)
  40. Z. Yu, L. Ferrer-Argemi, and J. Lee, “Investigation of thermal conduction in symmetric and asymmetric nanoporous structures,” Journal of Applied Physics 122, 244305, 2017. (Link)
  41. Y. Zhou, A. Morshedifard, J. Lee, and M.J.A. Qomi, “The contribution of propagons and diffusons in heat transport through calcium-silicate-hydrates,”  Applied Physics Letters 110, 043104, 2017. (Link)
  42. C. O’Dwyer, R. Chen, J-H He, J. Lee, and K. M. Razeeb “Scientific and Technical Challenges in Thermal Transport and Thermoelectric Materials and Devices,” Journal of Solid State Science and Technology 6(3), N3058-N3064, 2017. (Link)
  43. J. Lee†, W. Lee†, G. Wehmeyer†, S. Dhuey, D.L. Olynick, S. Cabrini, C. Dames, J. J. Urban, P. Yang, “Investigation of Phonon Coherence and Backscattering using Silicon Nanomeshes,” Nature Communications, 14054, 2017. (Link)
  44. J. Lee†, W. Lee†, J. Lim†, Y. Yu, Q. Kong, J. J. Urban, P. Yang, “Thermal Transport in Silicon Nanowires at High Temperature up to 700 K,” Nano Letters 16, 4133–4140, 2016. (Link)
  45. J. Lim, H. Wang, J. Tang, S. C. Andrews, J. Lee, D. Lee, T. P. Russell, P. Yang, “Simultaneous Thermoelectric Property Measurement and Incoherent Phonon Transport in Holey Silicon”, ACS Nano 10, 124–132, 2016. (Link)
  46. Shi, L., Dames, C., Likes, J.R., Reddy, P.S., Duda, J., Cahill, D.G., Lee, J., Marconnet, A., Goodson, K.E., Bahk, J.-H., Shakouri, A., Prasher, R.S., Felts, J., King, W.P., Han, B., Bischof, J.C., 2015, “Evaluating Broader Impacts of Nanoscale Thermal Transport Research,” Nanoscale and Microscale Thermophysical Engineering, vol. 19, no. 2, 2015. (Link)
  47. J. Lee, J. Lim, P. Yang, “Ballistic Phonon Transport in Holey Silicon,” Nano Letters 15, 3273–3279, 2015. (Link)
  48. R. G.D. Jeyasingh, S. Fong, J.Lee,  Z. Li, K.-W. Chang, D. Mantegazza, M. Asheghi, K. E. Goodson, and H.-S. P. Wong, 2012, “Ultrafast Characterization of Phase-Change Material Crystallization Properties in the Melt-Quenched Amorphous Phase,” Nano Letters, nl500940z, 2014. (Link)
  49. J. Lee, E. Bozorg-Grayeli, S. Kim, M. Asheghi, H.-S. P. Wong, and K. E. Goodson, “Phonon and Electron Transport through Ge2Sb2Te5 Films and Interfaces Bounded by Metals,” Applied Physics Letters, 102, 191911, 2013. (Link)
  50. Z. Li, R.G.D. Jeyasingh, J. Lee, M. Asheghi, H.-S. P. Wong, and K. E. Goodson, 2012, “Electrothermal Modeling and Design Strategies for Multibit Phase Change Memory,” IEEE Transactions on Electron Devices, 59, 3561-3567, Dec. 2012. (Link)
  51. J. Lee, T. Kodama, Y. Won, M. Asheghi, and K. E. Goodson, “Phase Purity and the Thermoelectric Properties of Ge2Sb2Te5 Films down to 25 nm Thickness,” Journal of Applied Physics, 112, 014902, Jul. 2012. (Link)
  52. Y. Won, J. Lee, M. Asheghi, T. W. Kenny, and K. E. Goodson, “Phase and Thickness Dependent Modulus of Ge2Sb2Te5 Films down to 25 nm Thickness,” Applied Physics Letters, vol. 100, 161905, Apr. 2012. (Link)
  53. J. Lee, M. Asheghi, and K. E. Goodson, “Impact of Thermoelectric Phenomena on Phase Change Memory Performance Metrics and its Scaling,” Nanotechnology, Vol. 23, 205201, Apr. 2012. (Link)
  54. J. Lee, S. Kim, A. Marconnet, M.A.A. in ‘t Zandt, M. Asheghi, H.-S. P. Wong, and K. E. Goodson, “Thermoelectric Characterization and Power Generation Using a Silicon-on-Insulator Substrate,” Journal of Microelectromechanical Systems, 2175704, Vol. 21, Feb. 2012. (Link)
  55. S. Yoneoka, J. Lee, M. Liger, G. Yama, T. Kodama, J. Provine, R. T. Howe, K. E. Goodson, and T. W. Kenny, “Electrical and thermal conduction in ALD nanobridges down to 7-nm thickness,” Nano Letters, ln203548w, 683-6, Jan. 2012. (Link)
  56. J. Lee, S. Kim, R. Jeyasingh, M. Asheghi, H.-S. P. Wong, and K. E. Goodson, “Micro Thermal Stage for Electrothermal Characterization of Phase Change Memory,” IEEE Electron Device Letters, vol.32, no.7, pp.952-954, Jul. 2011. (Link)
  57. Z. Li, J. Lee, J. P. Reifenberg, M. Asheghi, R. Jeyasingh, H.-S. P. Wong, and K. E. Goodson, Grain Boundaries, “Grain Boundaries, Phase Impurities, and Anisotropic Thermal Conduction in Phase-Change Memory,” IEEE Electron Device Letters, vol.32, no.7, pp.961-963, Jul. 2011. (Link)
  58. J. Lee, Z. Li, J. P. Reifenberg, M. Asheghi, and K. E. Goodson, “Thermal Conductivity Anisotropy and Grain Structure of Ge2Sb2Te5 Films,” Journal of Applied Physics, vol. 109, 084902, Apr. 2011. (Link)